Japan, Jan. 28 -- EVIDENT CO LTD has got intellectual property rights for 'OBJECTIVE LENS.' Other related details are as follows: Application Number: JP,2021-200482 Category (FI): G02B21/02,G02B21/0... Read More
Japan, Jan. 28 -- JAPAN DISPLAY INC has got intellectual property rights for 'TFT SUBSTRATE AND MANUFACTURING METHOD FOR TFT SUBSTRATE.' Other related details are as follows: Application Number: JP,2... Read More
Japan, Jan. 28 -- ROHM CO LTD has got intellectual property rights for 'SEMICONDUCTOR LIGHT-EMITTING DEVICE.' Other related details are as follows: Application Number: JP,2021-200103 Category (FI): ... Read More
Japan, Jan. 28 -- SHIMIZU CORP has got intellectual property rights for 'METHOD FOR PRODUCING ANION ADSORBENT.' Other related details are as follows: Application Number: JP,2021-199936 Category (FI)... Read More
Japan, Jan. 28 -- YAMAHA CORP has got intellectual property rights for 'SIGNAL GENERATION METHOD, SIGNAL GENERATION SYSTEM, ELECTRONIC MUSICAL INSTRUMENT AND PROGRAM.' Other related details are as fol... Read More
Japan, Jan. 28 -- SEIKO EPSON CORP has got intellectual property rights for 'PROJECTION METHOD AND PROJECTOR.' Other related details are as follows: Application Number: JP,2021-199815 Category (FI):... Read More
Japan, Jan. 28 -- ANGEL GROUP CO LTD has got intellectual property rights for 'CARD DRAWING METHOD AND TABLE GAME SYSTEM.' Other related details are as follows: Application Number: JP,2023-062431 Ca... Read More
Japan, Jan. 28 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'ELECTRONIC APPARATUS.' Other related details are as follows: Application Number: JP,2023-040952 Category (... Read More
Japan, Jan. 28 -- ALPHA CORP has got intellectual property rights for 'INLET BOX.' Other related details are as follows: Application Number: JP,2021-199663 Category (FI): B60K15/04@E,F16J15/10@N,F16... Read More
Japan, Jan. 28 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'FULLERENE-COATED BORON NITRIDE PARTICLES, RESIN COMPOSITION, RESIN SHEET, SEMICONDUCTOR DEVICE, AND MANUFACTURING METH... Read More